Kwinkqubo yemveliso yeIibhodi zesiphaluka zePCB, akunakuphepheka ukuba kuya kubakho iziphene ze-welding kunye neziphene zokubonakala.Ezi zinto ziya kubangela ingozi encinci kwibhodi yesekethe.Namhlanje, eli nqaku lazisa ngokweenkcukacha iziphene ze-welding eziqhelekileyo, iimpawu zenkangeleko, iingozi kunye nezizathu ze-PCBA.Makhe sijonge Yijonge!
I-Pseudo Soldering
Iimpawu zenkangeleko:kukho umda ocacileyo omnyama phakathi kwe-solder kunye nesikhokelo samacandelo okanye i-foil yobhedu, kwaye i-solder ifakwe kumda.
Ingozi:ayikwazi ukusebenza ngokuqhelekileyo.
Uhlalutyo lwesizathu:
1.Icandelo elikhokelayo alicocwa, lifakwe i-tin okanye i-oxidized.
2.Ibhodi eprintiweyo ayicocwanga kakuhle, kwaye umgangatho we-sprayed flux awulungile.
Ukuqokelela kweesoda
Iimpawu zenkangeleko:Isakhiwo esihlangeneyo se-solder sikhululekile, simhlophe kwaye sibuhlungu.
Uhlalutyo lwesizathu:
1.Umgangatho we-solder awulungile.
I-2.Ubushushu be-soldering akwanelanga.
3.Xa i-solder ingaqiniswanga, icandelo elikhokelela likhululekile.
I-solder eninzi kakhulu
Iimpawu zenkangeleko:Umphezulu we-solder u-convex.
Iingozi:Inkunkuma yesolder kwaye inokuba neziphene.
Uhlalutyo lwesizathu:Ukukhutshwa kwe-solder kusemva kwexesha.
Isolder encinci kakhulu
Iimpawu zenkangeleko:Ummandla we-welding ungaphantsi kwe-80% ye-pad, kwaye i-solder ayifaki inguqu egudileyo.
Ingozi:Amandla angonelanga oomatshini.
Uhlalutyo lwesizathu:
1.Ukuhamba kakubi kwe-solder okanye ukukhutshwa kwangaphambili kwe-solder.
2.Ukuguquguquka okunganelanga.
Ixesha le-3.Welding lifutshane kakhulu.
Rosin Welding
Iimpawu zenkangeleko:Kukho i-rosin slag kwi-weld.
Iingozi:Amandla angonelanga, ukuqhuba kakubi, kwaye inokuba ivuliwe kwaye ivaliwe.
Uhlalutyo lwesizathu:
1.Abaninzi kakhulu oomatshini bokuwelda okanye baye basilela.
I-2.Ixesha elinganeleyo le-welding kunye nokufudumeza okunganeleyo.
3.Ifilimu ye-oxide phezu komhlaba ayisuswanga.
Ubushushu obugqithisileyo
Iimpawu zenkangeleko:amalungu e-solder amhlophe, akukho luster yesinyithi, umphezulu orhabaxa.
Ingozi:I-pad kulula ukuyikhupha kwaye amandla ayancipha.
Uhlalutyo lwesizathu:
Amandla entsimbi ye-solder makhulu kakhulu kwaye ixesha lokufudumala lide kakhulu.
Ukuwelda okubandayo
Iimpawu zenkangeleko:Umphezulu ngamasuntswana afana ne-curd, kwaye ngamanye amaxesha kunokubakho iintanda.
Ingozi:amandla aphantsi, ukungahambi kakuhle kombane.
Uhlalutyo lwesizathu:Kukho i-jitter phambi kokuba i-solder iqiniswe.
Ukungenwa kakubi
Iimpawu zenkangeleko:Ujongano phakathi kwe-solder kunye ne-weldment inkulu kakhulu kwaye ayigudi.
Ingozi:ubunzulu obuphantsi, akukho mdibaniso okanye uqhagamshelo oluphakathi.
Uhlalutyo lwesizathu:
1.I-weldment ayicocekanga.
2.Ukuguquguquka okungonelanga okanye okukumgangatho ophantsi.
I-3.I-Weldments ayitshisi ngokwaneleyo.
I-asymmetrical
Iimpawu zenkangeleko:I-solder ayihambi kwi-pad.
Ingozi:Amandla angonelanga.
Uhlalutyo lwesizathu:
1.I-solder fluidity ayilungile.
2.Ukuguquguquka okungonelanga okanye okukumgangatho ophantsi.
3.Ukufudumeza okunganeleyo.
ikhululekile
Iimpawu zenkangeleko:Iingcingo okanye icandelo elikhokelayo lingasuswa.
Ingozi:ihlwempu okanye akukho conduction.
Uhlalutyo lwesizathu:
I-1.I-lead ihamba phambi kokuba i-solder iqine, ibangele i-voids.
I-2.Iikhokelo azilungiswanga kakuhle (zimbi okanye azimanziswanga).
Ukulola
Iimpawu zenkangeleko:Imbonakalo yengcebiso.
Ingozi:inkangeleko embi, kulula ukubangela i-bridging phenomenon.
Uhlalutyo lwesizathu:
1.I-flux encinci kunye nexesha elide lokufudumeza.
I-2.I-angle yentsimbi ye-solder ukurhoxisa ayifanelekanga.
Ukudibanisa
Iimpawu zenkangeleko:Iingcingo ezikufutshane zixhunyiwe.
Ingozi:Isiphaluka esifutshane sombane.
Uhlalutyo lwesizathu:
1.I-solder eninzi kakhulu.
I-2.I-angle yentsimbi ye-solder ukurhoxisa ayifanelekanga.
umngxuma wokuqhafaza
Iimpawu zenkangeleko:Kukho imingxuma ebonakalayo ngokuhlolwa okubonakalayo okanye ukukhulisa okuphantsi.
Ingozi:Amandla angonelanga, i-solder joints kulula ukubola.
Uhlalutyo lwesizathu:Umsantsa phakathi kwelethe kunye nomngxuma wepadi mkhulu kakhulu.
Ibhaqa
Iimpawu zenkangeleko:Ingcambu yelothe ine-solder ephefumla umlilo, kwaye kukho umngxuma ngaphakathi.
Ingozi:Ukuqhuba okwethutyana, kodwa kulula ukubangela ukuqhuba kakubi ixesha elide.
Uhlalutyo lwesizathu:
1.I-gap phakathi kwe-lead kunye ne-pad hole inkulu.
2.Ukumanzisa ilothe embi.
I-3.Ixesha le-welding yebhodi eliphindwe kabini ngokusebenzisa imingxuma lide, kwaye umoya kwimingxuma uyanda.
Ipolisangefoyile nganye iphakanyisiwe
Iimpawu zenkangeleko:I-foil yobhedu ihlanjululwe kwibhodi eprintiweyo.
Ingozi:Ibhodi eprintiweyo yonakele.
Uhlalutyo lwesizathu:Ixesha le-welding lide kakhulu kwaye ubushushu buphezulu kakhulu.
I-Peel
Iimpawu zenkangeleko:Amalungu e-solder ahlanjululwa kwi-foil yobhedu (kungekhona i-copper foil kunye nebhodi eprintiweyo).
Ingozi:Vula isiphaluka.
Uhlalutyo lwesizathu:Ukufakwa kwentsimbi engalunganga kwiphedi.
Emva kohlalutyo lwezizathu zePCB indibano yokuhlanganisaiziphene, sinethemba lokukunika eyona ndibaniselwano ingconoInkonzo yokuhlanganisa iqhosha le-PCB, umgangatho, ixabiso kunye nexesha lonikezelo kwi-batch yakho encinci yevolumu ye-PCB i-odolo yendibano kunye ne-Mid batch Volume PCB i-oda yendibano.
Ukuba ukhangela umenzi indibano PCB efanelekileyo, nceda uthumele iifayile zakho BOM neefayile PCB ku sales@pcbfuture.com.Zonke iifayile zakho ziyimfihlo kakhulu.Siza kukuthumelela ikhowuti echanekileyo kunye nexesha lokukhokela kwiiyure ezingama-48.
Ixesha lokuposa: Oct-09-2022