Ibhodi yeSekethe eprintiweyo isisiseko seemveliso ze-elektroniki, kubaluleke kakhulu ukuba iimveliso zakho zinokusebenza ngokuzinzileyo ixesha elide okanye hayi.Njengomvelisi we-PCB kunye ne-PCB yeNdibano ye-PCB, i-PCBFuture ibeka ixabiso eliphezulu kumgangatho weebhodi zesekethe.
PCBFuture iqale kwishishini PCB Fabrication, ngoko yandisa kwindibano PCB kunye neenkonzo zokufumana izixhobo, ngoku iye yaba yenye best turnkey PCB umenzi indibano.Senza iinzame ezininzi zotyalo-mali kwizixhobo eziphucukileyo zetekhnoloji engcono, inkqubo yangaphakathi ephuculweyo yokusebenza kakuhle, ukuxhobisa abasebenzi ngezakhono ezingcono.
| Inkqubo | Into | Inkqubo Yamandla | |
| Ulwazi olusisiseko | Isakhono seMveliso | Ubalo lobuleya | I-1-30 imigangatho |
| Saphetha kwaye ujije | 0.75% umgangatho, 0.5% phambili | ||
| Min.ubungakanani obugqityiweyo bePCB | 10 x 10mm(0.4 x 0.4") | ||
| Max.ubungakanani obugqityiweyo bePCB | 530 x 1000mm(20.9 x 47.24 ") | ||
| Ucinezela kaninzi kwii-vias ezingaboniyo/ezingcwatyiweyo | Umjikelo wokucofa kaninzi≤3 amaxesha | ||
| Ugqitywe ubukhulu bebhodi | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Kugqityiwe ukunyamezela ubukhulu bebhodi | +/-10% umgangatho, +/-0.1mm phambili | ||
| Ukugqitywa komphezulu | I-HASL, iKhokelo yasimahla yeHASL, igolide ekhanyayo, i-ENIG, i-hard gold plating, i-OSP, iTin yokuntywiliselwa, isilivere yokuntywiliselwa, njl. | ||
| Ukugqitywa komphezulu okhethiweyo | ENIG+Umnwe weGolide, Flash yegolide+umnwe weGolide | ||
| Uhlobo lwezinto eziphathekayo | I-FR4, i-Aluminiyam, i-CEM, i-Rogers, i-PTFE, i-Nelco, i-Polyimide / i-Polyester, njl. | Kananjalo unokuthenga izixhobo njengesicelo | |
| Ifoyile yobhedu | 1/3oz ~ 10oz | ||
| Prepreg Uhlobo | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, njl. | |
| Uvavanyo oluthembekileyo | Amandla e-Peel | 7.8N/cm | |
| Ukuba neFammability | 94V-0 | ||
| Usulelo lwe-Ionic | ≤1ug/cm² | ||
| Min.ubukhulu be-dielectric | 0.075mm(3mil) | ||
| Ukunyamezela kokunyamezela | +/-10%, min inokulawula +/- 7% | ||
| Umaleko ongaphakathi&Umaleko waNgaphandle wokuGqithisela umfanekiso | Ubunakho bomatshini | UMtshini wokuKhuhla | Izinto eziphathekayo: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Ubungakanani bezinto eziphathekayo: min.228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Izinto eziphathekayo: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Ubungakanani beMaterial: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Izinto eziphathekayo: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Ubungakanani bezinto eziphathekayo: min.177 x 177mm(7 x 7") | |||
| Isakhono seNkqubo yangaphakathi | Min.ububanzi bomgca wangaphakathi/isithuba | 0.075/0.075mm(3/3mil) | |
| Min.isithuba ukusuka eludinini lomngxuma ukuya kwi-conductive | 0.2mm(8mil) | ||
| Min.umaleko wangaphakathi annular ring | 0.1mm(4mil) | ||
| Min.umaleko wangaphakathi wokususwa wedwa | 0.25mm(10mil) umgangatho, 0.2mm(8mil) phambili | ||
| Min.isithuba ukusuka kungqameko lwebhodi ukuya kwi-conductive | 0.2mm(8mil) | ||
| Min.ububanzi besithuba phakathi komhlaba wobhedu | 0.127mm(5mil) | ||
| Ukungalungelelani kobunzima bobhedu kumbindi wangaphakathi | H/1oz, 1/2oz | ||
| Max.ubungqingqwa bobhedu obugqityiweyo | 10oz | ||
| Umaleko wangaphandle Inkqubo yokukwazi | Min.Ububanzi bomgca wangaphandle/isithuba | 0.075/0.075mm(3/3mil) | |
| Min.ubungakanani iphedi yomngxuma | 0.3mm(12mil) | ||
| Inkqubo Yamandla | Max.slot ubungakanani tenting | 5 x 3mm(196.8 x 118mil) | |
| Max.ubungakanani umngxuma intente | 4.5mm(177.2mil) | ||
| Min.intente ububanzi | 0.2mm(8mil) | ||
| Min.umsesane wonyaka | 0.1mm(4mil) | ||
| Min.Umgangatho weBGA | 0.5mm(20mil) | ||
| I-AOI | Ubunakho bomatshini | I-Orbotech SK-75 AOI | Izinto eziphathekayo: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Ubungakanani bezinto eziphathekayo: max.597 ~ 597mm(23.5 x 23.5") | |||
| Umatshini we-Orbotech Ves | Izinto eziphathekayo: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Ubungakanani bezinto eziphathekayo: max.597 ~ 597mm(23.5 x 23.5") | |||
| Ukugrumba | Ubunakho bomatshini | MT-CNC2600 Drill umatshini | Izinto eziphathekayo: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Ubungakanani bezinto eziphathekayo: max.470 ~ 660mm(18.5 x 26") | |||
| Min.ubungakanani bokuqhuba: 0.2mm(8mil) | |||
| Inkqubo Yamandla | Min.ubungakanani bentwana yokubetha kaninzi | 0.55mm(21.6mil) | |
| Max.Ubungakanani bebhodi (ubungakanani bebhodi egqityiweyo VS Drill ubukhulu) | 12:01 | ||
| Ukunyamezela indawo yomngxuma (xa kuthelekiswa neCAD) | +/-3mil | ||
| Umngxuma we-Counterbore | I-PTH&NPTH, i-engile ephezulu yi-130°, i-diameter ephezulu <6.3mm | ||
| Min.isithuba ukusuka eludinini lomngxuma ukuya kwi-conductive | 0.2mm(8mil) | ||
| Max.ubungakanani bit drill | 6.5mm(256mil) | ||
| Min.multi-hit slot ubukhulu | 0.45mm(17.7mil) | ||
| Ubungakanani bomngxuma wokunyamezela ucinezelo | +/-0.05mm(+/-2mil) | ||
| Min.PTH ubungakanani slot ukunyamezelana | +/-0.15mm(+/-6mil) | ||
| Min.NPTH ubungakanani slot ukunyamezelana | +/-2mm(+/-78.7mil) | ||
| Min.isithuba ukusuka eludinini lomngxuma ukuya kwi-conductive (i-Blind vias) | 0.23mm(9mil) | ||
| Min.laser drill ubukhulu | 0.1mm(+/-4mil) | ||
| I-engile yomngxuma we-Countersink&Diameter | Phezulu 82,90,120 ° | ||
| Inkqubo emanzi | Ubunakho bomatshini | Iphaneli kunye nomgca wokucwenga wePattern | Ubukhulu bezinto: 0.2 ~ 7.0mm(8 ~276mil) |
| Ubungakanani bezinto eziphathekayo: max.610 x 762mm(24 x 30") | |||
| Deburring Maching | Ubukhulu bezinto: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Ubungakanani bezinto eziphathekayo: min.203 x 203mm(8" x 8") | |||
| Desmear Line | Izinto eziphathekayo: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Ubungakanani bezinto eziphathekayo: max.610 x 762mm(24 x 30") | |||
| Umgca wokucwenga weTin | Izinto eziphathekayo: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Ubungakanani bezinto eziphathekayo: max.610 x 762mm(24 x 30") | |||
| Inkqubo Yamandla | Umngxuma udonga lobhedu ubukhulu | umndilili wama-25um(1mil) umgangatho | |
| Ugqitywe ubukhulu bobhedu | ≥18um(0.7mil) | ||
| Ububanzi bomgca omncinci wokuphawula uphawu | 0.2mm(8mil)) | ||
| Ubunzima bobhedu obugqityiweyo bomgangatho wangaphakathi & wangaphandle | 7oz | ||
| Ubunzima bobhedu olwahlukileyo | H/1oz,1/2oz | ||
| Imaski yeSolder kunye neSilkscreen | Ubunakho bomatshini | UMtshini wokuKhuhla | Izinto eziphathekayo: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Ubungakanani bezinto eziphathekayo: min.228 x 228mm(9 x 9") | |||
| Umbonisi | Izinto eziphathekayo: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Ubungakanani bezinto eziphathekayo: max.635 x 813mm(25 x 32") | |||
| Phuhlisa umatshini | Izinto eziphathekayo: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Ubungakanani bezinto eziphathekayo: min.101 x 127mm(4 x 5") | |||
| Umbala | Umbala wemaski yeSolder | Buhlaza, luhlaza matte, tyheli, mnyama, bhlowu, obomvu, omhlophe | |
| Umbala we-Silkscreen | Mhlophe, tyheli, mnyama, bhlowu | ||
| Solder Mask Ukukwazi | Min.i-solder mask yokuvula | 0.05mm(2mil) | |
| Max.iplagi ngobungakanani | 0.65mm(25.6mil) | ||
| Min.ububanzi bokufikelela kumgca nge-S/M | 0.05mm(2mil) | ||
| Min.solder imaski iintsomi ububanzi | 0.2mm(8mil) umgangatho, 0.17mm(7mil) phambili | ||
| Min.solder imaski ubukhulu | 10um(0.4mil) | ||
| Ubukhulu bemaski yesoda kusetyenziswa intente | 10um(0.4mil) | ||
| Min.carbon oil line ububanzi / isithuba | 0.25/0.35mm(10/14mil) | ||
| Min.umkhondo wekhabhoni | 0.06mm(2.5mil) | ||
| Min.carbon oil line trace | 0.3mm(12mil)) | ||
| Min.isithuba ukusuka kwipatheni yekhabhoni ukuya kwipads | 0.25mm(10mil) | ||
| Min.Ububanzi bomgca wesigqubuthelo semaski esi peelable / iphedi | 0.15mm(6mil) | ||
| Min.solder imaski ibhulorho ububanzi | 0.1mm(4mil)) | ||
| Imaski yeSolder Ukuqina | 6H | ||
| Isakhono seMaski ePeelable | Min.isithuba ukusuka kwipateni yemaski e peelable ukuya kwi pad | 0.3mm(12mil)) | |
| Max.ubungakanani bomngxuma wentente yemaski exobukayo (Ngoshicilelo lwesikrini) | 2mm(7.8mil) | ||
| Max.ubungakanani bomngxuma wentente yemaski exobukayo (Ngoshicilelo lwe-aluminiyam) | 4.5mm | ||
| Ubungqingqwa bemaski obu peelable | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Silkscreen Ukukwazi | Min.ububanzi bomgca we-silkscreen | 0.11mm(4.5mil) | |
| Min.ubude bomgca we-silkscreen | 0.58mm(23mil) | ||
| Min.isithuba ukusuka kwintsomi ukuya kwiphedi | 0.17mm(7mil) | ||
| Umphezulu Gqiba | Umphezulu wokuGqiba isakhono | Max.ubude beminwe yegolide | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) igolide | ||
| umnwe wegolide | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) igolide | ||
| I-HASL | 0.4um(0.016mil) Sn/Pb | ||
| Umatshini we-HASL | Izinto eziphathekayo: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Ubungakanani bezinto eziphathekayo: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Ukufakwa kwegolide enzima | 1-5u" | ||
| Ukuntywiliselwa kwiTin | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Ukuntywiliselwa kwesilivere | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| Uvavanyo lwe-E | Ubunakho bomatshini | Umvavanyi ophaphazelayo | Izinto eziphathekayo: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Ubungakanani bezinto eziphathekayo: max.498 x 597mm(19.6 ~ 23.5") | |||
| Min.isithuba ukusuka kwiphedi yovavanyo ukuya kumphetho webhodi | 0.5mm(20mil) | ||
| Min.ukumelana conductive | 5Ω | ||
| Max.ukumelana nokugquma | 250mΩ | ||
| Max.uvavanyo lombane | 500V | ||
| Min.ubungakanani iphedi yovavanyo | 0.15mm(6mil)) | ||
| Min.iphedi yovavanyo ukuya kwisithuba sepadi | 0.25mm(10mil) | ||
| Max.uvavanyo lwangoku | 200mA | ||
| Iprofayile | Ubunakho bomatshini | Uhlobo lweprofayili | Indlela ye-NC, i-V-cut, i-slot tabs, umngxuma wesitampu |
| Umatshini wokuhambisa i-NC | Izinto eziphathekayo: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Ubungakanani bezinto eziphathekayo: max.546 x 648mm(21.5 x 25.5") | |||
| Umatshini wokusika u-V | Izinto eziphathekayo: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Ubukhulu bemathiriyeli yobubanzi be-V-cut: 457mm(18") | |||
| Inkqubo Yamandla | Min.ubungakanani besuntswana lendlela | 0.6mm(23.6mil) | |
| Min.chaza unyamezelo | +/-0.1mm(+/-4mil) | ||
| Uhlobo lwe-engile ye-V-cut | 20°, 30°, 45°, 60° | ||
| Ukunyamezela i-angle ye-V-cut | +/-5 ° | ||
| Ukunyamezelana kobhaliso lwe-V-cut | +/-0.1mm(+/-4mil ) | ||
| Min.izithuba zeminwe yegolide | +/-0.15mm(+/-6mil) | ||
| Bevelling angle ukunyamezelana | +/-5 ° | ||
| I-Bevelling ihlala inyamezela ubunzima | +/-0.127mm(+/-5mil) | ||
| Min.iradiyasi yangaphakathi | 0.4mm(15.7mil) | ||
| Min.isithuba ukusuka kwi-conductive ukuya kulwandlalo | 0.2mm(8mil) | ||
| Ukunyamezela ubunzulu be-Counterbore | +/-0.1mm(+/-4mil) | ||