Inkqubo yokuvelisa indibano yePCB

I-PCBA ibhekisa kwinkqubo yokunyuswa, ukufakwa kunye nokuthengisela amacandelo e-PCB angenanto.Inkqubo yemveliso ye-PCBA kufuneka ihambe ngothotho lweenkqubo ukugqiba imveliso.Ngoku, i-PCBFuture iya kwazisa iinkqubo ezahlukeneyo zemveliso ye-PCBA.

Inkqubo yemveliso ye-PCBA inokwahlulwa ngokweenkqubo ezininzi ezinkulu, ukusetyenzwa kwepetshi ye-SMT→ukwenziwa kweplagi ye-DIP yokungena→uvavanyo lwePCBA→ukuhlanganiswa kwemveliso egqityiweyo.

Okokuqala, ikhonkco lokulungisa iqhosha le-SMT

Inkqubo yokwenziwa kwetshiphu ye-SMT yile: ukudibanisa i-solder paste→ushicilelo lwe-solder pala→i-SPI→ukunyuswa→i-reflow soldering→AOI→setyenzwa kwakhona

I-1, ukudibanisa i-solder paste

Emva kokuba i-solder paste ikhutshiwe kwisikhenkcisi kwaye inyibilika, ishukunyiswa ngesandla okanye ngomatshini ukuze ifanele ukuprinta kunye ne-soldering.

2, ukuprintwa kwe-solder paste

Beka i-solder paste kwi-stencil, kwaye usebenzise i-squeegee ukuprinta i-solder pads kwi-PCB pads.

3, SPI

I-SPI sisijongi sobukhulu be-solder paste, esinokubona ukuprintwa kwe-solder paste kunye nokulawula isiphumo soshicilelo lwe-solder paste.

4. Ukunyuka

Amacandelo e-SMD abekwe kwi-feeder, kunye nentloko yomatshini wokubekwa ngokuchanekileyo ibeka amacandelo kwi-feeder kwi-pads ye-PCB ngokuchongwa.

5. Reflow soldering

Dlulisa ibhodi yePCB exhonywe kwi-soldering ye-reflow, kwaye i-paste-efana ne-solder paste ifudunyezwa ibe lulwelo ngobushushu obuphezulu ngaphakathi, kwaye ekugqibeleni ipholiswe kwaye yaqina ukugqibezela i-solder.

6.AOI

I-AOI luhlolo oluzenzekelayo lwe-optical, olukwazi ukubona i-welding effect yebhodi ye-PCB ngokuskena, kwaye ibone iziphene zebhodi.

7. ukulungisa

Lungisa iziphene ezifunyenwe yi-AOI okanye ukuhlolwa ngesandla.

Okwesibini, i-DIP plug-in processing link

Inkqubo ye-DIP yokuqhuba iplagi-ngaphakathi yile: iplagi-in → i-wave soldering → ukusika unyawo → inkqubo ye-post welding → ibhodi yokuhlamba → ukuhlolwa komgangatho

1, iplagi-ngaphakathi

Yenza izikhonkwane zezixhobo zeplagi kwaye uzifake kwibhodi yePCB

2, i-wave soldering

Ibhodi efakiweyo ixhomekeke ekufakweni kwamaza.Kule nkqubo, itoti yolwelo iya kutshizwa kwibhodi yePCB, kwaye ekugqibeleni ipholiswe ukugqibezela i-soldering.

3, ukusika iinyawo

Izikhonkwane zebhodi ezithengiswayo zide kakhulu kwaye zifuna ukunqunyulwa.

4, post welding processing

Sebenzisa i-iron yokufaka i-solder yombane ukuze udibanise izixhobo.

5. Hlamba ipleyiti

Emva kwe-wave soldering, ibhodi iya kuba mdaka, ngoko kufuneka usebenzise amanzi okuhlamba kunye netanki yokuhlamba ukuyicoca, okanye usebenzise umatshini ukucoca.

6, ukuhlolwa komgangatho

Hlola ibhodi yePCB, iimveliso ezingafanelekanga kufuneka zilungiswe, kwaye kuphela iimveliso ezifanelekileyo ezinokungena kwinkqubo elandelayo.

Okwesithathu, uvavanyo lwe-PCBA

Uvavanyo lwe-PCBA lunokwahlulwa lube luvavanyo lwe-ICT, uvavanyo lwe-FCT, uvavanyo lokuguga, uvavanyo lokungcangcazela, njl.

Uvavanyo lwe-PCBA luvavanyo olukhulu.Ngokweemveliso ezahlukeneyo kunye neemfuno ezahlukeneyo zabathengi, iindlela zovavanyo ezisetyenziswayo zahlukile.

Okwesine, indibano yemveliso egqityiweyo

Ibhodi ye-PCBA evavanyiweyo idityaniselwe iqokobhe, kwaye emva koko ivavanywe, kwaye ekugqibeleni ingathunyelwa.

PCBA imveliso ikhonkco elinye emva kwenye.Nayiphi na ingxaki nakweyiphi na ikhonkco iya kuba nefuthe elikhulu kakhulu kumgangatho jikelele, kwaye kufuneka ulawulo olungqongqo lwenkqubo nganye.