Kutheni le nto kufuneka siplage i-vias kwi-PCB?

Kutheni le nto kufuneka siplage i-vias kwi-PCB?

Ukuze kuhlangatyezwane neemfuno zabathengi, imingxuma edlulayo kwibhodi yesekethe kufuneka iplagwe.Emva kokuziqhelanisa okuninzi, inkqubo yeplagi ye-aluminium yendabuko itshintshiwe, kwaye umnatha omhlophe usetyenziselwa ukugqibezela i-welding yokumelana kunye nomngxuma weplagi webhodi yesekethe, enokwenza imveliso izinzile kunye nomgangatho othembekileyo.

I-Via hole idlala indima ebalulekileyo ekudibaneni kweesekethe.Ngophuhliso lweshishini lombane, ikwakhuthaza uphuhliso lwePCB, kwaye ibeka phambili iimfuno eziphezulu zeUkwenziwa kwePCB kunye nokudibanisaiteknoloji.Itekhnoloji yeplagi yomngxuma ibekho, kwaye ezi mfuno zilandelayo kufuneka kuhlangatyezwane nazo:

(1) Ubhedu olusemngxunyeni lwanele, kwaye isigqubuthelo sobuso sinokuxhunywa okanye hayi;

(2) Kufuneka kubekho inkonkxa kunye nelothe emngxunyeni odlulayo, kunye nemfuneko ethile yobukhulu (ii-microns ezi-4), kungabikho inki yokuxhathisa i-solder emngxunyeni, ibangela ukuba amaso e-tin afihlwe emingxunyeni;

(3) Kufuneka kubekho umngxuma we-inki wokuxhathisa kwi-solder kumngxuma odlulayo, ongabonakali, kwaye kungabikho msesane, amaso enkcenkce kunye nomcaba.

Ngophuhliso lweemveliso ze-elektroniki kwicala "lokukhanya, elibhityileyo, elifutshane kunye nelincinci", iPCB nayo iphuhlisa ukuxinana okuphezulu kunye nobunzima obukhulu.Ke ngoko, kuye kwavela inani elikhulu le-SMT kunye ne-BGA PCBs, kwaye abathengi bafuna imingxuma yokuplaga xa kunyuswa amacandelo, anemisebenzi emihlanu.

(1) Ukuthintela isiphaluka esifutshane esibangelwa yinkcenkce ngokungena kumphezulu wento ngexesha le-PCB ngaphezulu kwe-wave soldering, ngakumbi xa sibeka umngxuma kwi-pad ye-BGA, kufuneka siqale senze umngxuma weplagi kwaye emva koko sibeke igolide ukwenza lula i-BGA soldering. .

(2) Ziphephe iintsalela eziguquguqukayo kwimingxuma edlulayo;

(3) Emva kokunyuka komphezulu kunye nendibano yecandelo lomzi-mveliso we-elektroniki, iPCB kufuneka ifunxe ivacuum yenze uxinzelelo olubi kumatshini wovavanyo;

(4) Thintela i-solder engaphezulu ekungeneni emngxunyeni, kwaye ibangele i-solder yobuxoki kwaye ichaphazele intaba;

(5) thintela i-solder bead ukuba ingaphumi ngexesha le-wave soldering, kwaye ibangele isiphaluka esifutshane.

Ukuphunyezwa kobuchwepheshe bomngxuma weplagi ngomngxuma

KubaIndibano ye-SMT PCBibhodi, ngakumbi ukunyuswa kwe-BGA kunye ne-IC, iplagi edlula umngxuma mayibe sicaba, iconvex kunye neconcave dibanisa okanye thabatha 1mil, kwaye akufuneki kubekho inkonkxa ebomvu kwincam yendlela edlulayo;ukuze kuhlangatyezwane neemfuno zabathengi, inkqubo yomngxuma weplagi yomngxuma ingachazwa njengezinto ezininzi, ukuhamba kwenkqubo ende, ukulawulwa kwenkqubo enzima, kuhlala kukho iingxaki ezinjengokwehla kweoyile ngexesha lomgangatho oshushu womoya kunye novavanyo lokuxhathisa i-oyile eluhlaza kunye nokuqhuma kweoyile emva koko. ukunyanga.Ngokweemeko zokwenyani zemveliso, sishwankathela iinkqubo ezahlukeneyo zeplagi emngxunyeni wePCB, kwaye senza uthelekiso kunye nokucacisa kwinkqubo kunye nezinto eziluncedo nezingeloncedo:

Qaphela: umgaqo osebenzayo womgangatho womoya oshushu kukusebenzisa umoya oshushu ukususa i-solder engaphezulu kumphezulu webhodi yesekethe eprintiweyo kunye nomngxuma, kwaye i-solder eseleyo igqunywe ngokulinganayo kwi-pad, imigca ye-solder engathinteli kunye neendawo zokupakisha zomhlaba. , enye yeendlela zonyango oluphezulu lwebhodi yesekethe eprintiweyo.

1. Inkqubo yokuplaga umngxuma emva komgangatho womoya oshushu: ukuwelda komphezulu wepleyiti → HAL → umngxuma weplagi → ukunyanga.Inkqubo engeyiyo iplagi yamkelwe kwimveliso.Emva komgangatho womoya oshushu, isikrini se-aluminiyam okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela iplagi yomngxuma kuzo zonke iinqaba ezifunwa ngabathengi.I-inki yomngxuma weplagi ingaba yi-inki ye-photosensitive okanye inki ye-thermosetting, kwimeko yokuqinisekisa umbala ofanayo wefilimu emanzi, i-inki yomngxuma weplagi ingcono ukusebenzisa i-inki efanayo nebhodi.Le nkqubo inokuqinisekisa ukuba umngxuma odlulayo awuzukuwisa ioyile emva komgangatho womoya oshushu, kodwa kulula ukwenza i-inki yomngxuma weplagi ingcolise umphezulu wepleyiti kwaye ingalingani.Kulula kubathengi ukuba babangele i-soldering yobuxoki ngexesha lokunyuka (ingakumbi i-BGA).Ke, abathengi abaninzi abayamkeli le ndlela.

2. Inkqubo yokudibanisa umngxuma phambi komgangatho womoya oshushu: 2.1 umngxuma weplagi kunye nephepha le-aluminium, qinisa, ugaye ipleyiti, kwaye emva koko udlulise imizobo.Le nkqubo isebenzisa umatshini wokugrumba we-CNC ukukhupha iphepha le-aluminiyam elifuna ukutsalwa umngxuma, ukwenza ipleyiti yesikrini, umngxuma weplagi, qinisekisa ukuba umngxuma weplagi umngxuma ugcwele, i-inki yomngxuma weplagi, inki yokubeka i-thermosetting nayo ingasetyenziswa.Iimpawu zayo kufuneka zibe nobunzima obuphezulu, utshintsho oluncinci lwe-resin, kunye nokunamathela kakuhle kunye nodonga lomngxuma.Inkqubo yethekhinoloji yile ilandelayo: Unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ukuhanjiswa kwepateni → ukudibanisa → ukuwelda umphezulu wepleyiti.Le ndlela inokuqinisekisa ukuba umngxuma weplagi womngxuma ugudileyo, kwaye ukunyuswa komoya oshushu akusayi kuba neengxaki zomgangatho ezifana nogqabhuko-dubulo lwe-oyile kunye nokuwa kwe-oyile kumngxunya.Nangona kunjalo, le nkqubo idinga ukuqina kwexesha elinye lobhedu ukwenza ubukhulu bobhedu bodonga lomngxuma buhlangabezane nomgangatho womthengi.Ngoko ke, ineemfuno eziphezulu zokubethelwa kobhedu kweplate yonke kunye nokusebenza kweplate grinder, ukwenzela ukuba kuqinisekiswe ukuba i-resin kwindawo yobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye alungcoliswanga.Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo azikwazi ukuhlangabezana neemfuno, ngoko ke le nkqubo ayifane isetyenziswe kwimizi-mveliso ye-PCB.

(Isikrini sesilika esingenanto) (Indawo yokutyela ifilimu inetha)

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