1, Umgangatho wesolder womoya oshushu
Ibhodi yesilivere ibizwa ngokuba yi-tin hot air solder leveling board.Ukutshiza umaleko we-tin kumaleko angaphandle wesekethe yobhedu kukuqhuba kwi-welding.Kodwa ayinakubonelela ngokuthembeka koqhagamshelwano lwexesha elide njengegolide.Xa uyisebenzisa ixesha elide, kulula uku-oxidize kunye nokugqwala, okukhokelela ekudibaneni kakubi.
Izinto eziluncedo:Ixabiso eliphantsi, ukusebenza kakuhle kwe-welding.
Izinto ezingeloncedo:Umphezulu othe tyaba webhodi yokulinganisa i-solder yomoya oshushu ayilunganga, engafanelekanga kwizikhonkwane ze-welding ezine-gap encinci kunye namacandelo amancinci kakhulu.Amaso enkcenkce kulula ukuvelisa kuwoUkuqhubekeka kwePCB, ekulula ukubangela isiphaluka esifutshane kwizinto ezincinci ze-gap pin.Xa isetyenziselwa inkqubo ye-SMT enamacala amabini, kulula kakhulu ukutshiza i-tin iyanyibilika, okukhokelela kumaso e-tin okanye amachaphaza e-tin angqukuva, okukhokelela kumhlaba ongalinganiyo ngakumbi kwaye kuchaphazele iingxaki ze-welding.
2. Isilivere yokuntywiliselwa
Inkqubo yesilivere yokuntywiliselwa ilula kwaye iyakhawuleza.Isilivere yokuntywiliselwa yimpendulo yokufuduswa, ephantse ibe yi-submicron esulungekileyo yokwaleka isilivere (5 ~ 15 μ Ngaphakathi, malunga ne-0.1 ~ 0.4 μ m) Ngamanye amaxesha inkqubo yokuntywiliselwa kwesilivere iqulethe izinto eziphilayo, ikakhulu ukuthintela ukubola kwesilivere kunye nokuphelisa ingxaki. Ukufuduka kwesilivere Nokuba ibonakaliswe kubushushu, ukufuma kunye nongcoliseko, isenokubonelela ngeempawu zombane ezilungileyo kwaye igcine ukuwelda okulungileyo, kodwa iya kulahlekelwa ukubengezela.
Izinto eziluncedo:Umphezulu we-welding wesilivere une-weldability elungileyo kunye ne-coplanarity.Kwangaxeshanye, ayinayo imiqobo yokuqhuba njenge-OSP, kodwa amandla ayo awalunganga njengegolide xa isetyenziswa njengendawo yokunxibelelana.
Izinto ezingeloncedo:Xa ibonakaliswe kwindawo emanzi, isilivere iya kuvelisa ukufuduka kwe-electron phantsi kwesenzo sombane.Ukongeza izinto eziphilayo kwisilivere kunokunciphisa ingxaki yokufuduka kwe-electron.
3. Itoti yokuntywiliselwa
Itoti yokuntywiliselwa ithetha ukurhabula ngesoda.Ngaphambili, i-PCB yayithanda ukuba namabhovu enkcenkce emva kwenkqubo yokuntywiliselwa kwitoti.Amabhovu e-tin kunye nokufuduka kwe-tin ngexesha le-welding kuya kunciphisa ukuthembeka.Emva koko, izongezelelo ze-organic zongezwa kwisisombululo sokucwiliswa kwe-tin, ukwenzela ukuba i-tin layer structure ibe yigranular, eyoyisa iingxaki zangaphambili, kwaye ibe nokuzinza okuhle kwe-thermal kunye ne-weldability.
Izinto ezingeloncedo:Obona buthathaka bukhulu bokuntywiliselwa kwetoti bubomi bayo obufutshane benkonzo.Ngokukodwa xa igcinwe kwindawo yokushisa ephezulu kunye nomswakama ophezulu, iikhompawundi phakathi kweentsimbi zeCu / Sn ziya kuqhubeka zikhula de zilahlekelwe yi-solderability.Ngoko ke, iipleyiti ezifakwe kwi-tin azikwazi ukugcinwa ixesha elide.
Sinentembelo ekuboneleleni ngeyona ndibaniselwano ilungileyoinkonzo yendibano yePCB turnkey, umgangatho, ixabiso kunye nexesha lonikezelo kwi-batch yakho encinci yevolumu ye-PCB i-odolo yendibano kunye ne-Mid batch Volume PCB i-oda yendibano.
Ukuba ukhangela umenzi indibano PCB efanelekileyo, nceda uthumele iifayile zakho BOM neefayile PCB kusales@pcbfuture.com.Zonke iifayile zakho ziyimfihlo kakhulu.Siza kukuthumelela ikhowuti echanekileyo kunye nexesha lokukhokela kwiiyure ezingama-48.
Ixesha lokuposa: Nov-21-2022