Emva kokuba siyile iibhodi PCB, kufuneka sikhethe inkqubo yonyango lomphezulu webhodi yesiphaluka.Iinkqubo zonyango ezisetyenziswa ngokuqhelekileyo kwibhodi yesekethe yi-HASL (inkqubo yokutshiza i-tin ebusweni), i-ENIG (inkqubo yokucwiliswa kwegolide), i-OSP (inkqubo yokulwa ne-oxidation), kunye nomgangatho oqhelekileyo osetyenziswayo Kufuneka sikhethe njani inkqubo yonyango?Iinkqubo ezahlukeneyo zonyango ze-PCB zineendleko ezahlukeneyo, kwaye iziphumo zokugqibela nazo zahlukile.Unokukhetha ngokweyona meko.Makhe ndikuxelele malunga nezinto eziluncedo kunye nezingeloncedo kwiinkqubo ezintathu ezahlukeneyo zonyango lomphezulu: i-HASL, i-ENIG, kunye ne-OSP.
1. I-HASL (inkqubo yokutshiza ngetoti engaphezulu)
Inkqubo yokutshiza ngenkcenkce yohlulwe ngokwetoti yokutshiza ilothe kunye nesitshizi setoti esingenalothe.Inkqubo yokutshiza ngenkcenkce yayiyeyona nkqubo ibalulekileyo yonyango lomphezulu ngeminyaka yoo-1980.Kodwa ngoku, iibhodi zesekethe ezincinci nezimbalwa zikhetha inkqubo yokutshiza ngetoti.Isizathu kukuba ibhodi yesekethe kwindlela "encinci kodwa egqwesileyo".Inkqubo ye-HASL iya kukhokelela kwiibhola ezihluphekileyo ze-solder, i-ball point tin component ebangelwa xa i-welding ilungileIinkonzo zeNdibano yePCBisityalo ukuze ufune imigangatho ephezulu kunye nobuchwepheshe bomgangatho wemveliso, i-ENIG kunye ne-SOP iinkqubo zonyango zomphezulu zihlala zikhethwa.
Uncedo lwetoti etshizwe ngelothe : ixabiso eliphantsi, ukusebenza kakuhle kwewelding, amandla angcono oomatshini kunye neglosi kunetoti etshizwe ngelothe.
Ububi betoti etshizwe ngelothe: Itoti etshizwe ngelothe iqulethe iintsimbi ezinzima, ezingahambelani nokusingqongileyo kwimveliso kwaye ayinakudlula uvavanyo lokukhuselwa kwendalo olufana ne-ROHS.
Izinto eziluncedo zokutshiza ngetoti engenalothe: ixabiso eliphantsi, ukusebenza kakuhle kwe-welding, kunye nokuhambelana nokusingqongileyo, kunokudlula i-ROHS kunye nolunye uvavanyo lokukhuselwa kwendalo.
Ububi besitshizi setoti esingenalothe: Amandla oomatshini kunye neglosi ayilunganga njengesitshizi setoti esingenalothe.
Ukungalungi okuqhelekileyo kwe-HASL: Ngenxa yokuba umphezulu webhodi ye-tin-sprayed ayilungile, ayifanelekanga ukuba izikhonkwane ze-soldering ezinezithuba ezintle kunye namacandelo amancinci kakhulu.Amaso e-tin aveliswa ngokulula kwi-PCBA processing, enokubangela ukuba iisekethe ezimfutshane kumacandelo anezikhewu ezintle.
2. ENIG(Inkqubo yokutshona kwegolide)
Inkqubo yokucwiliswa kwegolide yinkqubo yonyango ephezulu, esetyenziswa kakhulu kwiibhodi zeesekethe ezineemfuno zokudibanisa okusebenzayo kunye nexesha elide lokugcina phezu komhlaba.
Izinto ezilungileyo ze-ENIG: Akulula ukuba i-oxidize, ingagcinwa ixesha elide, kwaye inomphezulu osicaba.Kufanelekile ukudibanisa izikhonkwane ze-gap kunye namacandelo anamalungu amancinci amancinci.I-Reflow inokuphinda iphindwe ngamaxesha amaninzi ngaphandle kokunciphisa i-solderability yayo.Ingasetyenziswa njenge substrate kwi COB wire bonding.
Ukungalungi kwe-ENIG: Iindleko eziphezulu, amandla amabi we-welding.Ngenxa yokuba i-electroless nickel plating process isetyenziswa, kulula ukuba nengxaki yediski emnyama.Umaleko we-nickel oxidizes ngokuhamba kwexesha, kwaye ukuthembeka kwexesha elide kungumba.
3. I-OSP (inkqubo yokuchasana ne-oxidation)
I-OSP yifilimu ephilayo eyenziwe ngemichiza kumphezulu wobhedu olungenanto.Le filimu ine-anti-oxidation, ukushisa kunye nokumelana nomswakama, kwaye isetyenziselwa ukukhusela ubuso bobhedu kwi-rust (i-oxidation okanye i-vulcanization, njl.) kwindawo eqhelekileyo, elingana nonyango oluchasene ne-oxidation.Nangona kunjalo, kwi-solder ephezulu yobushushu obulandelayo, ifilimu ekhuselayo kufuneka isuswe ngokulula yi-flux, kwaye indawo yobhedu ecocekileyo evezwayo inokudibaniswa ngokukhawuleza kunye ne-solder etyhidiweyo ukwenza i-solder eqinile ngexesha elifutshane kakhulu.Okwangoku, umlinganiselo weebhodi zeesekethe usebenzisa inkqubo ye-OSP yonyango yomgangatho uye wanda kakhulu, kuba le nkqubo ifanelekile kwiibhodi zeesekethe eziphantsi kunye neebhodi zeesekethe eziphezulu.Ukuba akukho mfuneko yoxhulumaniso oluphezulu olusebenzayo okanye umda wexesha lokugcina, inkqubo ye-OSP iya kuba yeyona nkqubo ifanelekileyo yonyango lomphezulu.
Izinto eziluncedo ze-OSP:Inayo yonke inzuzo ye-welding yobhedu engenanto.Ibhodi ephelelwe lixesha (iinyanga ezintathu) inokuphinda ifakwe kwakhona, kodwa idla ngokukhawulelwa kwixesha elinye.
Izinto ezingeloncedo kwi-OSP:I-OSP ichaphazeleka kwiasidi kunye nokufuma.Xa isetyenziselwa i-reflow soldering yesibini, kufuneka igqitywe ngexesha elithile.Ngokuqhelekileyo, umphumo we-soldering ye-reflow yesibini iya kuba yimbi.Ukuba ixesha lokugcinwa lidlula kwiinyanga ezintathu, kufuneka lihlaziywe.Sebenzisa kwiiyure ezingama-24 emva kokuvula iphakheji.I-OSP ngumaleko okhuselayo, ngoko ke indawo yokuvavanya kufuneka iprintwe kunye ne-solder paste ukususa umaleko we-OSP wokuqala ukuqhagamshelana ne-pin point yokuvavanya umbane.Inkqubo yokuhlanganisa ifuna utshintsho olukhulu, ukuphonononga imiphezulu yobhedu ekrwada kuyonakalisa i-ICT, iiprobe ze-ICT ezingaphezulu zingonakalisa i-PCB, zifuna ukunyanzelwa ngesandla, ukunciphisa uvavanyo lwe-ICT kunye nokunciphisa ukuphindaphinda kovavanyo.
Oku ngasentla kuhlalutyo lwenkqubo yonyango ye-surface ye-HASL, i-ENIG kunye neebhodi zeesekethe ze-OSP.Unokukhetha inkqubo yonyango lomphezulu oza kusebenzisa ngokwenyani yokusetyenziswa kwebhodi yesekethe.
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Ixesha lokuposa: Jan-31-2022