Sihlala sidibana nokuthengiswa kwe-BGA ehluphekileyo kwinkqubo yenkqubo yendibano yePCB ngenxa yoyilo lwePCB olungafanelekanga emsebenzini.Ke ngoko, i-PCBFuture iya kwenza isishwankathelo kunye nentshayelelo kwiingxaki ezininzi zoyilo eziqhelekileyo kwaye ndiyathemba ukuba inokubonelela ngezimvo ezixabisekileyo kubayili bePCB!
Kukho ikakhulu ezi zinto zilandelayo:
1. I-vias engezantsi ye-BGA ayilungiswanga.
Kukho ngemingxunya kwi-pad ye-BGA, kwaye iibhola ze-solder zilahlekile kunye ne-solder ngexesha lenkqubo ye-solder;Imveliso ye-PCB ayiphumezi inkqubo ye-mask ye-solder, kwaye ibangela ukulahlekelwa kweebhola ze-solder kunye ne-solder ngokusebenzisa i-vias esecaleni kwe-pad, okubangelwa ukuba iibhola ze-solder zilahlekile, njengoko kuboniswe kumfanekiso olandelayo.
2.Imaski ye-solder ye-BGA ayilwanga kakuhle.
Ukubekwa kwemingxuma kwi-PCB pads kuya kubangela ilahleko ye-solder;Indibano ye-PCB enoxinano oluphezulu kufuneka ithathe i-microvia, i-vias eyimfama okanye iinkqubo zokuplaga ukuphepha ilahleko ye-solder;Njengoko kubonisiwe kulo mfanekiso ulandelayo, isebenzisa wave soldering, kwaye kukho vias ezantsi BGA.Emva kokuthengisela amaza, i-solder kwi-vias ichaphazela ukuthembeka kwe-BGA ye-solder, ebangela iingxaki ezifana neesekethe ezimfutshane zamacandelo.
3. Uyilo lwephedi yeBGA.
Intambo ekhokelayo ye-pad ye-BGA akufanele idlule i-50% ye-diameter ye-pad, kwaye ucingo olukhokelayo lwe-pad yonikezelo lwamandla akufanele lube ngaphantsi kwe-0.1mm, kwaye emva koko luyijiyile.Ukuze kuthintelwe i-deformation ye-pad, i-solder mask window ayifanele ibe mkhulu kune-0.05mm, njengoko kuboniswe kumfanekiso olandelayo.
4.Ubungakanani bePCB BGA pad ayifani kwaye inkulu kakhulu okanye incinci kakhulu, njengoko kubonisiwe kulo mfanekiso ungezantsi.
5. Iipads ze-BGA zineesayizi ezahlukeneyo, kwaye i-solder joints ziyizangqa ezingaqhelekanga zobukhulu obuhlukeneyo, njengoko kuboniswe kumzobo ongezantsi.
6. Umgama phakathi komgca wesakhelo seBGA kunye nomphetho wecandelo lomzimba usondele kakhulu.
Zonke iinxalenye zamacandelo kufuneka zibe phakathi koluhlu lokumakisha, kwaye umgama phakathi komgca wesakhelo kunye nomda wepakethe yecandelo kufuneka ube ngaphezu kwe-1/2 yobukhulu bokuphela kwe-solder yecandelo, njengoko kuboniswe kumfanekiso ongezantsi.
I-PCBFuture yi-PCB yobuchwephesha kunye nomvelisi wendibano ye-PCB onokubonelela ngemveliso ye-PCB, indibano ye-PCB kunye neenkonzo zokufumana izixhobo.Inkqubo yokuqinisekisa umgangatho ogqibeleleyo kunye nezixhobo ezahlukeneyo zokuhlola zisinceda ukuba sibeke iliso kuyo yonke inkqubo yemveliso, siqinisekise uzinzo lwale nkqubo kunye nomgangatho ophezulu wemveliso, okwangoku, izixhobo eziphambili kunye neendlela zobugcisa ziye zaziswa ukuze kuphunyezwe uphuculo oluzinzileyo.
Ixesha lokuposa: Feb-02-2021